Semiconductor Bonding Market Projected to reach $1,059 million by 2026
The global semiconductor bonding market size is projected to grow USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% during the forecast period. Factors such as growing demand for MEMs and surge in demand for electric vehicle are driving the growth of the market during the forecast period.
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Notable R&D investments and technological advances have
increased the demand for reliable and high-performance miniaturized electronic
components, such as microelectromechanical systems (MEMS) and
microoptoelectromechanical systems (MOEMS), from high-growth and high-value
industries, including aerospace, military, automotive, consumer electronics,
and medical. Die bonder equipment are extensively being used for the assembly
and packaging of MEMS and MOEMS devices. MEMS and MOEMS devices find
applications in sensors, robotics, microvalves, flow controllers, global
positioning systems (GPS), and biotechnology. The microfabrication capability
of die bonders makes them ideal for the assembly and packaging of MEMS and
MOEMS.
Driver: Increasing adoption of stacked die technology in
IoT devices
The semiconductor bonding market is experiencing growth due
to the increasing use of stacked die technology in IoT devices. Stacked die
involves attaching bare die on top of each other within a single semiconductor
package, which allows for multiple functionalities to be used in the same
placement area on a substrate. This results in better electrical performance of
devices, as the shorter routing of interconnections between circuits leads to
faster signal generation. Original equipment manufacturers (OEMs) in the
semiconductor industry are interested in exploiting the benefits of IoT beyond
connectivity.
Opportunity: Expanding IC industry in China
The growth of the wafer bonding market can be attributed to
the increasing demand for thin wafers in the semiconductor industry. Thin
wafers have advantages such as ultra-low power consumption and ultra-high
electrical performance, and have helped overcome many traditional fabrication
processes. Chinese IC manufacturers are interested in leveraging this
technology due to the need for thin chips that offer high performance at a low
operating voltage and low cost. As a result, wafer bonding and other thin wafer
technologies are gaining popularity among Chinese IC manufacturers such as
Hisilicon Technologies, Co., Ltd., Spreadtrum Communications, and RDA
Microelectronics.
APAC exhibit the highest CAGR during the forecast period
The APAC region is expected to continue dominating the
semiconductor bonding market in terms of size and CAGR in the coming years.
This is due to the presence of a large number of foundries, IDM, and OSAT
companies in the region, as well as the headquarters of major IDMs and foundry
players across the world. The increasing number of IDMs in the region is also
expected to boost market growth in the near future. Additionally, the mass
production of electronic products such as smartphones, wearables, and white
goods in China and Taiwan is expected to accelerate the market's growth in the
APAC region.
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Increasing demand for 3D semiconductor assembly and
packaging
The increasing use of 3D chip modules is expected to drive
the semiconductor bonding market in the near future. 3D ICs are manufactured by
stacking two or more semiconductors vertically, using different bonding methods
such as adhesive, soft soldering, and eutectic. Other than taking less space,
3D packaging offers high product performance and lower power consumption. Die
bonders ensure a smooth bonding process by offering micro-level precision,
which is required for the fabrication of 3D chip modules. The growing adoption
of 3D semiconductor components, increasing competition among outsourced
semiconductor assembly and testing (OSAT) companies and foundries, and rising
demand for MEMS and MOEMS from the automotive industry are expected to boost
the growth of the semiconductor bonding market in the near future. 3D ICs are
used in RF transmitters and transceivers, which are critical components of
mobile devices.
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