Future of 3D IC Packaging: Opportunities in the 3D Stacking Market
The 3D stacking industry size is expected to reach USD 3.1 billion by 2028 from USD 1.2 billion in 2023, at a CAGR of 20.4% during the forecast period.The major factors driving the market growth of the 3D stacking industry are increasing focus on miniaturization and efficient space utilization in electronic devices, increasing need for advanced architecture in electronic products, heterogeneous integration and component optimization to improve manufacturing of electronic components and the growing demand for gaming devices and consumer electronic s. Download PDF Brochure @ https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=59730409 By segment, 3D stacking industry for 3D TSV stacking technology is expected to account for the largest share of the market during the forecast period. TSV technology is instrumental in the development of 3D stacking DRAMs, often in conjunction with microbump interconnects. Furthermore, the use of lasers has been explored in the fabrication o...