Semiconductor Bonding Market Opportunities and Challenges
The global semiconductor bonding market size is projected to grow from USD 887 million in 2021 to USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% from 2021 to 2026. Factors such as growing demand for MEMs and surge in demand for electric vehicle are driving the growth of the market during the forecast period.
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Notable R&D investments and technological advances have
increased the demand for reliable and high-performance miniaturized electronic
components, such as microelectromechanical systems (MEMS) and
microoptoelectromechanical systems (MOEMS), from high-growth and high-value
industries, including aerospace, military, automotive, consumer electronics,
and medical. Die bonder equipment are extensively being used for the assembly
and packaging of MEMS and MOEMS devices. MEMS and MOEMS devices find
applications in sensors, robotics, microvalves, flow controllers, global
positioning systems (GPS), and biotechnology. The microfabrication capability
of die bonders makes them ideal for the assembly and packaging of MEMS and
MOEMS.
Advancements in electronic devices with the adoption of the
latest semiconductor technology have led to the development of multi-chip
modules (MCM) in logic ICs, memory chips, RF devices, and sensors, which can be
integrated into smaller systems and miniature electronic devices. Also,
3D-integrated ICs, MEMS, and MCM have made it possible to mount small form
factor electronic components on a substrate. As a result of significant R&D
investments by many companies, die bonders offering placement accuracy of more
than 5 ìm are available to ensure high-speed and high-precision assembly of
MCMs, MEMS devices, and other components and enable miniaturization of
electronic devices without loss of performance. Die bonder equipment facilitate
the assembly of power devices, high-power communication devices, LED packages,
servers, and portable electronics. Thus, the capability of die bonders to
assemble nano-sized components for miniaturized electronic devices is driving
the growth of the semiconductor bonding market.
Die bonder is expected to be the largest type segment of the
semiconductor bonding market with market size of USD 410.6 million in 2021.
Increasing demand for miniature electronic components is a major driving factor
for the growth of the die bonder equipment market. Increasing demand for 3D
semiconductor assembly and packaging is an opportunity for the manufacturers in
the die bonder equipment market. However, the high cost of ownership is
hindering the growth of the market. Key players are launching new products to
increase their market penetration. For instance, in April 2021, ASM Pacific
Technology launched three new manufacturing systems with X-Celeprint’s Micro
Transfer Printing and ASM AMICRA’s high-precision die bonding technology to
enable high-volume heterogeneous integration of ultra-thin dies up to 300 mm
base wafer. Panasonic offers MD-P200 die bonder that offers high-quality
bonding with multi-small die stacking capabilities, which contribute to
reducing the size of various devices. It has flip chip and thermosonic bonding
capabilities, which contribute to higher densification and performance for
semiconductor devices. MD-P200 is used in the production of sensors and RF
devices.
APAC exhibit the highest CAGR during the forecast period
APAC is likely to continue to dominate the semiconductor
bonding market, in terms of size and CAGR, in the coming years. The commanding
position of APAC is due to the presence of a large number of foundries, IDM,
and OSAT companies in the region. The major IDMs and foundry players present
across the world have their headquarters in APAC. These companies use die
bonding equipment in the semiconductor fabrication process. Additionally, an
increasing number of IDMs in the region is expected to boost market growth in
the near future. Similarly, the mass production of electronic products such as
smartphones, wearables, and white goods in China and Taiwan is also expected to
accelerate the market’s growth in APAC.
Increasing demand for 3D semiconductor assembly and
packaging
The increasing use of 3D chip modules is expected to drive
the semiconductor bonding market in the near future. 3D ICs are manufactured by
stacking two or more semiconductors vertically, using different bonding methods
such as adhesive, soft soldering, and eutectic. Other than taking less space,
3D packaging offers high product performance and lower power consumption. Die
bonders ensure a smooth bonding process by offering micro-level precision,
which is required for the fabrication of 3D chip modules. The growing adoption
of 3D semiconductor components, increasing competition among outsourced
semiconductor assembly and testing (OSAT) companies and foundries, and rising
demand for MEMS and MOEMS from the automotive industry are expected to boost
the growth of the semiconductor bonding market in the near future. 3D ICs are
used in RF transmitters and transceivers, which are critical components of
mobile devices.
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For instance, semiconductor foundries, such as Teledyne
DALSA and Teledyne Micralyne, contribute significantly to the market’s growth.
These foundries need thin wafers for the manufacturing of 3D-integrated
circuits and power semiconductor devices. The initiatives undertaken by the
Canadian government are also supporting the market’s growth. In 2019, the
Canadian government invested USD 96 million to support the coast-to-coast
electric vehicle charging network, along with natural gas stations. Also, consumers
of electric vehicles in the country can obtain incentives of up to USD 5000.
Electric vehicles extensively use electric components such as LEDs, power
devices, MEMS, and photodiodes. The need to produce efficient components is
expected to boost the requirement for thin wafers and wafer bonding equipment.
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